The first dossier on reliability prediction was released by Radio Corporation of America (RCA) it was called TR-1100, Reliability Stress Analysis for Electronic Equipment. By the 1960s, spurred onġ The authors are at the Center for Advanced Life Cycle Engineering at the University of Maryland.īy Cold War events and the space race, reliability prediction and environmental testing became a full-blown professional discipline (Caruso, 1996). This step was the inception of reliability prediction for electronics. The specification of reliability requirements, in turn, led to a need for a method to estimate reliability before the equipment was built and tested. One of these groups concluded that in order to improve performance, the reliability of the components needed to be verified by testing before full-scale production. These failures led to various studies and the creation of ad hoc groups to identify ways in which the reliability of electronic systems could be improved. During this period, electronic tubes were the most failure-prone components used in electronic systems (McLinn, 1990 Denson, 1998). Lastly, this paper briefly reviews RIAC 217 Plus and identifies the shortcomings of this methodology.Īttempts to test and quantify the reliability of electronic components began in the 1940s during World War II. The effect of these shortcomings on the predictions obtained from MIL-HDBK-217 and similar methodologies are then demonstrated through a review of case studies. It then reviews some of the specific details of MIL-HDBK-217 and its progeny and summarizes the major pitfalls of MIL-HDBK-217 and similar approaches.

This paper begins with a brief history of reliability prediction of electronics and MIL-HDBK-217.

Anto Peter, Diganta Das, and Michael Pecht 1

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